acer travelmate 270 compal_la-1341_rev2a schematic
acer travelmate 270=1=compal_la-1341_rev2a.pdf
Technical Specifications
Technical Summary
This Compal LA-1341 schematic details a Mobile Northwood platform motherboard built around the SIS 961 southbridge and SIS 650 northbridge with embedded 315 graphics. The system utilizes DDR memory operating at 200/266 MHz across two DDR-SO-DIMM slots. Embedded controller functionality is provided by an NS87591 EC/KBC interfacing via LPC to X-BUS and a Super I/O ENE CB1420. The board features an AC-LINK audio codec, a MAX1617 thermal sensor, and an RTL 8100BL LAN controller. Power management is handled by a dedicated DC/DC interface and power circuit. The BIOS is present on the LPC bus. The schematic also includes a Mini PCI port for WLAN expansion, a TV-OUT connector for display output, and an SIS302LV LVDS/TVOUT controller for card reader and display functions.
Technician FAQ
Q: What EC/KBC is used on this Compal LA-1341 motherboard?
A: The EC/KBC is an NS87591, interfacing via LPC to X-BUS and a Super I/O ENE CB1420.
Q: What is the memory architecture and configuration?
A: The board supports DDR memory at 200/266 MHz, with two DDR-SO-DIMM slots.
Q: What LAN controller is used?
A: The LAN controller is an RTL 8100BL.
Q: What thermal sensor is present?
A: The thermal sensor is a MAX1617.
Technical data structured and organized by Dr-Bios.com, based on original schematic source analysis.
acer travelmate 270=1=compal_la-1341_rev2a.pdf
Technical Specifications
| Parameter | Value |
|---|---|
| Brand | Compal |
| Motherboard Manufacturer | Compal Electronics, Inc. |
| Document Number | LA-1341 |
| Date | 2002 |
| CPU Platform | Mobile Northwood |
| PCH / Southbridge | SIS 961 |
| GPU Type | SIS 650 |
| Graphics Architecture | 315 Graphics embedded |
| EC / KBC | NS87591 |
| EC/KBC Package | LPC to X-BUS & Super I/O ENE CB1420 |
| Audio Codec | AC-LINK |
| BIOS / SPI Flash | BIOS |
| Charging IC | DC/DC Interface |
| Power IC(s) | Power Circuit DC/DC |
| RAM Type | DDR |
| RAM Architecture | DDR 200/266 MHz |
| RAM Quantity / Slots | DDR-SO-DIMM X2 |
| Thermal Sensor | MAX1617 |
| Card Reader IC | SIS302LV ( LVDS/TVOUT ) |
| LAN IC | RTL 8100BL |
| WiFi / WLAN IC | Mini PCI port |
| HDMI Level Shifter | TV-OUT Conn |
Technical Summary
This Compal LA-1341 schematic details a Mobile Northwood platform motherboard built around the SIS 961 southbridge and SIS 650 northbridge with embedded 315 graphics. The system utilizes DDR memory operating at 200/266 MHz across two DDR-SO-DIMM slots. Embedded controller functionality is provided by an NS87591 EC/KBC interfacing via LPC to X-BUS and a Super I/O ENE CB1420. The board features an AC-LINK audio codec, a MAX1617 thermal sensor, and an RTL 8100BL LAN controller. Power management is handled by a dedicated DC/DC interface and power circuit. The BIOS is present on the LPC bus. The schematic also includes a Mini PCI port for WLAN expansion, a TV-OUT connector for display output, and an SIS302LV LVDS/TVOUT controller for card reader and display functions.
Technician FAQ
Q: What EC/KBC is used on this Compal LA-1341 motherboard?
A: The EC/KBC is an NS87591, interfacing via LPC to X-BUS and a Super I/O ENE CB1420.
Q: What is the memory architecture and configuration?
A: The board supports DDR memory at 200/266 MHz, with two DDR-SO-DIMM slots.
Q: What LAN controller is used?
A: The LAN controller is an RTL 8100BL.
Q: What thermal sensor is present?
A: The thermal sensor is a MAX1617.
Technical data structured and organized by Dr-Bios.com, based on original schematic source analysis.
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