HP 15 BDL50 LA-D703P BDL50 (REV 1.0) Schematic
Technical Specifications
Technical Summary
This Compal BDL50 LA-D703P Broadwell motherboard schematic, dated 2015/01/31 revision 1.0, details an Intel ULV Processor platform with DDR3L 1600MHz 1.35V dual-channel memory architecture supporting two DDR3L-SO-DIMM slots. The embedded controller is an ENE KB9022, and the system utilizes a SPI ROM for BIOS/SPI flash storage. Audio is handled by an ALC3227 codec, while the charging architecture is AMD EXO-Pro using the M33018W charging IC. Networking includes a LAN8166E LAN IC and an H1168P BGA WLAN module. The board features an RTD2132N eDP to LVDS transmitter, an RTD2168 DP to VGA transmitter for HDMI level shifting, an RTS5141 card reader, an NCT7718 thermal sensor, and an SLB 9665 TPM.
Technician FAQ
Q: What EC/KBC is used on this motherboard?
A: The embedded controller is an ENE KB9022.
Q: What is the charging architecture and charging IC?
A: The charging architecture is AMD EXO-Pro, utilizing the M33018W charging IC.
Q: What memory configuration does this board support?
A: It supports DDR3L 1600MHz 1.35V dual-channel memory via two DDR3L-SO-DIMM slots.
Q: What audio codec is used?
A: The audio codec is an ALC3227.
Technical data structured and organized by Dr-Bios.com, based on original schematic source analysis.
Technical Specifications
| Parameter | Value |
|---|---|
| Brand | Compal |
| Model | Broadwell |
| Motherboard Manufacturer | Compal Electronics, Inc. |
| Project Code | BDL50 |
| Board Number | LA-D703P |
| Revision | 1.0 |
| Date | 2015/01/31 |
| CPU Platform | Intel ULV Processor with DDRIIIL Broadwell M/B |
| Platform Alias | Ultra Light & Thin(BDW ULT) |
| EC / KBC | ENE KB9022 |
| Audio Codec | ALC3227 |
| BIOS / SPI Flash | SPI ROM |
| Charging IC | M33018W |
| Charger Architecture | AMD EXO-Pro |
| RAM Type | DDR3L 1600MHz 1.35V |
| RAM Architecture | Dual Channel |
| RAM Quantity / Slots | DDR3L-SO-DIMM X 2 |
| Card Reader IC | RTS5141 |
| LAN IC | LAN8166E |
| WiFi / WLAN IC | H1168P BGA |
| HDMI Level Shifter | RTD2168 |
| Thermal Sensor | NCT7718 |
| eDP to LVDS Transmitter | RTD2132N |
| TPM | SLB 9665 |
Technical Summary
This Compal BDL50 LA-D703P Broadwell motherboard schematic, dated 2015/01/31 revision 1.0, details an Intel ULV Processor platform with DDR3L 1600MHz 1.35V dual-channel memory architecture supporting two DDR3L-SO-DIMM slots. The embedded controller is an ENE KB9022, and the system utilizes a SPI ROM for BIOS/SPI flash storage. Audio is handled by an ALC3227 codec, while the charging architecture is AMD EXO-Pro using the M33018W charging IC. Networking includes a LAN8166E LAN IC and an H1168P BGA WLAN module. The board features an RTD2132N eDP to LVDS transmitter, an RTD2168 DP to VGA transmitter for HDMI level shifting, an RTS5141 card reader, an NCT7718 thermal sensor, and an SLB 9665 TPM.
Technician FAQ
Q: What EC/KBC is used on this motherboard?
A: The embedded controller is an ENE KB9022.
Q: What is the charging architecture and charging IC?
A: The charging architecture is AMD EXO-Pro, utilizing the M33018W charging IC.
Q: What memory configuration does this board support?
A: It supports DDR3L 1600MHz 1.35V dual-channel memory via two DDR3L-SO-DIMM slots.
Q: What audio codec is used?
A: The audio codec is an ALC3227.
Technical data structured and organized by Dr-Bios.com, based on original schematic source analysis.
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