Lenovo V14 G2 ITL LCFC NM-D474 Schematic
Technical Specifications
Technical Summary
This LCFC Hs460/Hs560/Hs760 (NM-D474) motherboard, revision REV1.0 dated 2020-06-01, is built on the Intel Tiger Lake UP3 platform with DDR4 memory architecture combining Memory Down and Slot-DIMM configurations. The system utilizes an IT8586E EC/KBC in a VFBGA128 package, with a W25Q128JVSIQ_SO8 16MB SPI ROM for BIOS and a W25R64JVSSIQ_SO8 8MB SPI ROM for EC mirror code. Graphics processing is handled by discrete NVIDIA GPUs, either the NV N18S:U_GPU_GB2E_64 or NV N17S:U_GPU_GB2D_64 in FCBGA595 packages with GDDR5 VRAM, with an option for dGPU to UMA conversion on V14V15 variants. Power management includes a TI BQ24780SRUYR switch-mode battery charger and multiple switching converters from Richtek, Silergy, and UPI. Audio is provided by a Realtek ALC3287 codec, and the board features a RTS5448 Type-C MUX for USB 3.1 Gen1 connectivity.
Technician FAQ
Q: What BIOS IC model is used on this motherboard?
A: The BIOS SPI ROM is a W25Q128JVSIQ in an SO8 package, with a capacity of 16MB.
Q: Is the EC/KBC programmable on this motherboard?
A: Yes, the IT8586E EC/KBC has a dedicated 8MB SPI ROM (W25R64JVSSIQ_SO8) for mirror code, indicating programmable capability.
Technical Specifications
| Parameter | Value |
|---|---|
| Brand | LCFC |
| Model | Hs460/Hs560/Hs760 |
| Motherboard Manufacturer | LCFC |
| Board Number | NM-D474 |
| Revision | REV1.0 |
| Date | 2020-06-01 |
| CPU Platform | Tiger Lake UP3 |
| EC / KBC | IT8586E |
| EC/KBC Package | VFBGA128 |
| Audio Codec | Realtek ALC3287 |
| BIOS / SPI Flash | W25Q128JVSIQ_SO8 |
| BIOS Flash Capacity | 16MB |
| BIOS Flash Package | SO8 |
| EC Flash / ROM | W25R64JVSSIQ_SO8 |
| Charging IC | TI BQ24780SRUYR |
| Charger Architecture | Switch Mode |
| RAM Type | DDR4 |
| RAM Architecture | Memory Down + Slot-DIMM |
| Thermal Sensor | F75303M |
| Card Reader IC | IT8586E |
| LAN IC | IT8586E |
| WiFi / WLAN IC | Intel MCP |
| GPU Type | NV N18S:U_GPU_GB2E_64 / NV N17S:U_GPU_GB2D_64 |
| Graphics Architecture | GDDR5 |
| dGPU Chip Number | NV N18S:U_GPU_GB2E_64 / NV N17S:U_GPU_GB2D_64 |
| dGPU to UMA Conversion Support | Option for V14V15 |
| Power IC(s) | Richtek LV5116AGQW / Silergy LV5083AGQU / Richtek LV5095B / UPI UP1666QQKF / RT3602ACGQW |
| USB Hub IC | RTS5448 |
Technical Summary
This LCFC Hs460/Hs560/Hs760 (NM-D474) motherboard, revision REV1.0 dated 2020-06-01, is built on the Intel Tiger Lake UP3 platform with DDR4 memory architecture combining Memory Down and Slot-DIMM configurations. The system utilizes an IT8586E EC/KBC in a VFBGA128 package, with a W25Q128JVSIQ_SO8 16MB SPI ROM for BIOS and a W25R64JVSSIQ_SO8 8MB SPI ROM for EC mirror code. Graphics processing is handled by discrete NVIDIA GPUs, either the NV N18S:U_GPU_GB2E_64 or NV N17S:U_GPU_GB2D_64 in FCBGA595 packages with GDDR5 VRAM, with an option for dGPU to UMA conversion on V14V15 variants. Power management includes a TI BQ24780SRUYR switch-mode battery charger and multiple switching converters from Richtek, Silergy, and UPI. Audio is provided by a Realtek ALC3287 codec, and the board features a RTS5448 Type-C MUX for USB 3.1 Gen1 connectivity.
Technician FAQ
Q: What BIOS IC model is used on this motherboard?
A: The BIOS SPI ROM is a W25Q128JVSIQ in an SO8 package, with a capacity of 16MB.
Q: Is the EC/KBC programmable on this motherboard?
A: Yes, the IT8586E EC/KBC has a dedicated 8MB SPI ROM (W25R64JVSSIQ_SO8) for mirror code, indicating programmable capability.
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