Salim Badakhshan
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Dell Precision 7520 7720 LA-E321P Rev 10_1130_BOM Schematic
Technical Specifications
Technical Summary
This Dell CRANE17 motherboard, manufactured by Compal Electronics, is built on the LA-E321P Rev 1.0 (A00) board design, dated 2016.11.30. The platform is based on the Intel Kaby Lake H-type (2 chip) architecture. The system BIOS is stored on a W25Q128FVSIQ SPI flash IC, while the EC firmware resides on a separate W25Q32FVSSIQ flash. The embedded controller is a SMSC KBC MEC5085, supported by a SMSC SIO ECE5048. Memory architecture utilizes DDR4 ECC-SO-DIMM X4 modules. The integrated LAN controller is an Intel Jacksonville WGI219LM, and wireless connectivity is handled by a BRCM58100 module. Graphics expansion is provided via an MXM Connector TYPE A supporting PEG x16 (Gen3). The audio codec is an ALC3254, and the system includes a discrete TPM NPCT650JB2YX. Power management and USB charging are managed by SLGC55544CVTR controllers.
Technician FAQ
Q: What BIOS IC model is used on this motherboard?
A: The BIOS is stored on a W25Q128FVSIQ SPI flash IC.
Q: What EC/KBC is used and is it programmable?
A: The EC/KBC is a SMSC KBC MEC5085. The EC firmware is stored on a separate W25Q32FVSSIQ SPI flash IC.
Q: What is the memory architecture of this motherboard?
A: The memory architecture is DDR4 ECC-SO-DIMM X4.
Q: What is the graphics expansion capability?
A: The motherboard supports an MXM Connector TYPE A with a PEG x16 (Gen3) interface.
Technical data structured and organized by Dr-Bios.com, based on original schematic source analysis.
Technical Specifications
| Parameter | Value |
|---|---|
| Brand | DELL |
| Model | CRANE17 |
| Motherboard Manufacturer | Compal Electronics, Inc. |
| Board Number | LA-E321P |
| Revision | 1.0 (A00) |
| Date | 2016.11.30 |
| CPU Platform | Kaby Lake H-type (2 chip) |
| EC / KBC | SMSC KBC MEC5085 |
| Audio Codec | ALC3254 |
| BIOS Flash Exact Model | W25Q128FVSIQ |
| EC Flash / ROM | W25Q32FVSSIQ |
| RAM Type | DDR4 |
| RAM Architecture | DDR4 ECC-SO-DIMM X4 |
| LAN IC | Intel Jacksonville WGI219LM |
| WiFi / WLAN IC | BRCM58100 |
| Card Reader IC | RTS5242 |
| USB Hub IC | PS8713B |
| Charging IC | SLGC55544CVTR |
| Power IC(s) | SLGC55544CVTR |
| HDMI Level Shifter | PS8407A |
| GPU Type | MXM Conn. TYPE A |
| Graphics Architecture | PEG x16 (Gen3) |
| dGPU Chip Number | MXM Conn. TYPE A |
| TPM | NPCT650JB2YX |
| SIO | SMSC SIO ECE5048 |
Technical Summary
This Dell CRANE17 motherboard, manufactured by Compal Electronics, is built on the LA-E321P Rev 1.0 (A00) board design, dated 2016.11.30. The platform is based on the Intel Kaby Lake H-type (2 chip) architecture. The system BIOS is stored on a W25Q128FVSIQ SPI flash IC, while the EC firmware resides on a separate W25Q32FVSSIQ flash. The embedded controller is a SMSC KBC MEC5085, supported by a SMSC SIO ECE5048. Memory architecture utilizes DDR4 ECC-SO-DIMM X4 modules. The integrated LAN controller is an Intel Jacksonville WGI219LM, and wireless connectivity is handled by a BRCM58100 module. Graphics expansion is provided via an MXM Connector TYPE A supporting PEG x16 (Gen3). The audio codec is an ALC3254, and the system includes a discrete TPM NPCT650JB2YX. Power management and USB charging are managed by SLGC55544CVTR controllers.
Technician FAQ
Q: What BIOS IC model is used on this motherboard?
A: The BIOS is stored on a W25Q128FVSIQ SPI flash IC.
Q: What EC/KBC is used and is it programmable?
A: The EC/KBC is a SMSC KBC MEC5085. The EC firmware is stored on a separate W25Q32FVSSIQ SPI flash IC.
Q: What is the memory architecture of this motherboard?
A: The memory architecture is DDR4 ECC-SO-DIMM X4.
Q: What is the graphics expansion capability?
A: The motherboard supports an MXM Connector TYPE A with a PEG x16 (Gen3) interface.
Technical data structured and organized by Dr-Bios.com, based on original schematic source analysis.
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