Salim Badakhshan
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HP 250 G7 Compal LA-G07FP EPW50 Rev 1.0 v0.3 Schematic
Technical Specifications
Technical Summary
This Compal LA-G07FP motherboard, project code 2018 OPP_Harry Potter (15.6"), is built on the Kabylake-U (2+2) platform with DDR4-SO-DIMM X2 dual-channel memory. The discrete graphics subsystem uses either an nVidia N16S-GTR (MX130) or N16V-GMR1 (MX110) GPU. The embedded controller is an ENE KB9022Q, and the audio codec is an ALC3247-CG. The BIOS SPI flash is located at UC1 with an 8MB capacity. Power management is handled by a BQ24725 charger IC and multiple voltage regulators including SY8288C, SY8286B, G5616B, G5719P, RT8812A, SY8286R, and RT3602AE. The board integrates an RTL8111HSH-CG LAN controller, an AK6485RB63-GLF-GR card reader, and an SLB9670VQ2.0 TPM module.
Technician FAQ
Q: What is the board number and project code for this motherboard?
A: The board number is LA-G07FP, and the project code is 2018 OPP_Harry Potter (15.6").
Q: What EC/KBC and audio codec are used on this motherboard?
A: The EC/KBC is an ENE KB9022Q, and the audio codec is an ALC3247-CG.
Q: What is the BIOS flash IC reference and capacity?
A: The BIOS SPI flash is located at UC1 with an 8MB capacity.
Q: What charging IC and power ICs are used on this motherboard?
A: The charging IC is a BQ24725. Power ICs include SY8288C, SY8286B, G5616B, G5719P, RT8812A, SY8286R, and RT3602AE.
Technical data structured and organized by Dr-Bios.com, based on original schematic source analysis.
Technical Specifications
| Parameter | Value |
|---|---|
| Brand | Compal |
| Model | EPW50:LA-G07FP |
| Motherboard Manufacturer | Compal Electronics, Inc. |
| Project Code | 2018 OPP_Harry Potter (15.6") |
| Board Number | LA-G07FP |
| Revision | v0.3 |
| Date | 2018-01-08 |
| CPU Platform | Kabylake-U (2+2) |
| GPU Type | nVidia N16S-GTR (MX130) / N16V-GMR1 (MX110) |
| Graphics Architecture | GM108-670/770 (GeForce MX130) / GM108-626/726 (GeForce MX110) |
| EC / KBC | ENE KB9022Q |
| Audio Codec | ALC3247-CG |
| BIOS / SPI Flash | UC1 |
| BIOS Flash Capacity | 8MBytes |
| Charging IC | BQ24725 |
| Power IC(s) | SY8288C / SY8286B / G5616B / G5719P / RT8812A / SY8286R / RT3602AE |
| RAM Type | DDR4-SO-DIMM X2 |
| RAM Architecture | Dual Channel Interleaved |
| RAM Quantity / Slots | 2 |
| Card Reader IC | AK6485RB63-GLF-GR |
| LAN IC | RTL8111HSH-CG |
| WiFi / WLAN IC | JWLAN |
| TPM | SLB9670VQ2.0 |
Technical Summary
This Compal LA-G07FP motherboard, project code 2018 OPP_Harry Potter (15.6"), is built on the Kabylake-U (2+2) platform with DDR4-SO-DIMM X2 dual-channel memory. The discrete graphics subsystem uses either an nVidia N16S-GTR (MX130) or N16V-GMR1 (MX110) GPU. The embedded controller is an ENE KB9022Q, and the audio codec is an ALC3247-CG. The BIOS SPI flash is located at UC1 with an 8MB capacity. Power management is handled by a BQ24725 charger IC and multiple voltage regulators including SY8288C, SY8286B, G5616B, G5719P, RT8812A, SY8286R, and RT3602AE. The board integrates an RTL8111HSH-CG LAN controller, an AK6485RB63-GLF-GR card reader, and an SLB9670VQ2.0 TPM module.
Technician FAQ
Q: What is the board number and project code for this motherboard?
A: The board number is LA-G07FP, and the project code is 2018 OPP_Harry Potter (15.6").
Q: What EC/KBC and audio codec are used on this motherboard?
A: The EC/KBC is an ENE KB9022Q, and the audio codec is an ALC3247-CG.
Q: What is the BIOS flash IC reference and capacity?
A: The BIOS SPI flash is located at UC1 with an 8MB capacity.
Q: What charging IC and power ICs are used on this motherboard?
A: The charging IC is a BQ24725. Power ICs include SY8288C, SY8286B, G5616B, G5719P, RT8812A, SY8286R, and RT3602AE.
Technical data structured and organized by Dr-Bios.com, based on original schematic source analysis.
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