Reputation:
hp compaq 8710w 8710p compal la-3331p_rev1.0 schematic
hp compaq 8710w 8710p=1=compal la-3331p_rev1.0.pdf
Technical Specifications
Technical Summary
This Compal LA-3331P revision 1.0 motherboard, dated 2007-05-15, is built around the Mobile Merom uFCPGA-478 CPU platform with Intel Crestline_PM MCH and ICH8-M southbridge core logic. The system BIOS is stored on an ST M25P32 SPI flash ROM. Embedded controller functions are handled by an SMSC KBC 10706, with a separate SMSC LPC47N217 Super I/O for legacy I/O management. Memory configuration consists of two DDR2-SO-DIMM slots supporting dual-channel architecture at 667 MHz. Integrated audio is provided by an AD1981H codec paired with a MAX9710 amplifier. Networking capabilities include an Intel 82566MM Gigabit LAN controller and a Broadcom 802.11b/g WLAN module. The platform supports a discrete GPU via an MXM III connector. Additional notable components include an ICS9LPRS355 clock generator, Rico R5C583 CardBus and card reader controller, ADM1032ARMZ thermal sensor, SLB9635TTA TPM, and AES1610 fingerprint sensor.
Technician FAQ
Q: What BIOS IC model is used on this motherboard?
A: The BIOS SPI flash is an ST M25P32.
Q: What EC/KBC controller is used on this motherboard?
A: The embedded controller is an SMSC KBC 10706.
Q: What is the memory configuration of this motherboard?
A: The motherboard supports two DDR2-SO-DIMM modules in dual-channel configuration at 667 MHz.
Q: What is the graphics architecture of this motherboard?
A: The motherboard uses an MXM III connector for discrete GPU support.
Technical data
hp compaq 8710w 8710p=1=compal la-3331p_rev1.0.pdf
Technical Specifications
| Parameter | Value |
|---|---|
| Brand | Compal |
| Motherboard Manufacturer | Compal Electronics, Inc. |
| Project Code | LA-3331P |
| Board Number | LA-3331P |
| Revision | 1.0 |
| Date | 2007-05-15 |
| CPU Platform | Mobile Merom uFCPGA with Intel Crestline_PM+ICH8-M core logic |
| CPU Socket | uFCPGA-478 |
| PCH / Southbridge | Intel ICH8-M |
| EC / KBC | SMSC KBC 10706 |
| Audio Codec | AD1981H |
| BIOS / SPI Flash | ST M25P32 |
| BIOS Flash Exact Model | ST M25P32 |
| BIOS Flash Capacity | 32 Mbit (4 MB) |
| Charging IC | SLB9635TTA |
| RAM Type | DDR2-SO-DIMM |
| RAM Architecture | Dual Channel |
| RAM Quantity / Slots | 2 |
| Thermal Sensor | ADM1032ARMZ |
| Card Reader IC | Rico R5C583 |
| LAN IC | Intel 82566MM |
| WiFi / WLAN IC | Broadcom 802.11b/g WLAN |
| Super I/O | SMSC LPC47N217 |
| Clock Generator | ICS9LPRS355 |
| Audio Amplifier | MAX9710 |
| Fingerprint Sensor | AES1610 |
| TPM | TPM1.2 |
| CardBus Controller | Rico R5C583 |
| Graphics Architecture | MXM III Connector |
| dGPU Chip Number | MXM III |
Technical Summary
This Compal LA-3331P revision 1.0 motherboard, dated 2007-05-15, is built around the Mobile Merom uFCPGA-478 CPU platform with Intel Crestline_PM MCH and ICH8-M southbridge core logic. The system BIOS is stored on an ST M25P32 SPI flash ROM. Embedded controller functions are handled by an SMSC KBC 10706, with a separate SMSC LPC47N217 Super I/O for legacy I/O management. Memory configuration consists of two DDR2-SO-DIMM slots supporting dual-channel architecture at 667 MHz. Integrated audio is provided by an AD1981H codec paired with a MAX9710 amplifier. Networking capabilities include an Intel 82566MM Gigabit LAN controller and a Broadcom 802.11b/g WLAN module. The platform supports a discrete GPU via an MXM III connector. Additional notable components include an ICS9LPRS355 clock generator, Rico R5C583 CardBus and card reader controller, ADM1032ARMZ thermal sensor, SLB9635TTA TPM, and AES1610 fingerprint sensor.
Technician FAQ
Q: What BIOS IC model is used on this motherboard?
A: The BIOS SPI flash is an ST M25P32.
Q: What EC/KBC controller is used on this motherboard?
A: The embedded controller is an SMSC KBC 10706.
Q: What is the memory configuration of this motherboard?
A: The motherboard supports two DDR2-SO-DIMM modules in dual-channel configuration at 667 MHz.
Q: What is the graphics architecture of this motherboard?
A: The motherboard uses an MXM III connector for discrete GPU support.
Technical data
Indexed motherboard components
Open a component to see every indexed schematic that uses the same part.
LA-3331P
Project Code
LA-3331P
Board Number
Merom
CPU Platform
ICH8
PCH / Southbridge
10706
EC / KBC
AD1981H
Audio Codec
ST M25P32
BIOS / EC Flash
SLB9635TTA
Charging / PD IC
DDR2
RAM Type
ADM1032ARMZ
Thermal / Fan Control
RICO R5C583
Card Reader IC
82566MM
LAN Controller
LPC47N217
Super I/O
ICS9LPRS355
Clock Generator
MAX9710
Audio Amplifier
TPM1.2
TPM / Security IC
MXM III Connector
Graphics
Indexed motherboard components
Open a component to see every indexed schematic that uses the same part.
LA-3331P
Project Code
LA-3331P
Board Number
Merom
CPU Platform
ICH8
PCH / Southbridge
10706
EC / KBC
AD1981H
Audio Codec
ST M25P32
BIOS / EC Flash
SLB9635TTA
Charging / PD IC
DDR2
RAM Type
ADM1032ARMZ
Thermal / Fan Control
RICO R5C583
Card Reader IC
82566MM
LAN Controller
LPC47N217
Super I/O
ICS9LPRS355
Clock Generator
MAX9710
Audio Amplifier
TPM1.2
TPM / Security IC
MXM III Connector
Graphics
Attachments
Last edited: