hp compaq presario a900 compal_la-3981p_rev0.2 schematic
hp compaq presario a900=1=compal_la-3981p_rev0.2.pdf
Technical Specifications
Technical Summary
This Compal LA-3981P revision 0.3 schematic, dated 2007-08-02, documents the LEON 1.0 platform featuring a Mobile Merom uFCPGA CPU in a Socket P with the Santa Rosa platform. The platform architecture is Merom + Crestline + ICH8, with the Crestline GPU integrated. The system uses an ENE KB926 EC/KBC and an SPI ROM BIOS flash, specifically the 25LF080A model. Memory configuration consists of two DDR2 SO-DIMM slots supporting DDR2-400/533/667. The audio subsystem is handled by a Conexant CX20561-12 codec, and networking is provided by a Realtek RTL8100CL LAN IC. Thermal management is managed by an ADM1032AR sensor. The board supports a USB card reader and includes a CX20548 modem.
Technician FAQ
Q: What BIOS IC model is used on this motherboard?
A: The BIOS SPI ROM is a 25LF080A.
Q: What EC/KBC controller is used on this motherboard?
A: The EC/KBC is an ENE KB926.
Q: What is the platform architecture of this motherboard?
A: The platform is LEON 1.0, consisting of a Mobile Merom CPU, Crestline graphics, and an ICH8 southbridge.
Q: What is the memory configuration on this motherboard?
A: The board supports two DDR2 SO-DIMM slots with DDR2-400/533/667 memory.
Technical data structured and organized by Dr-Bios.com, based on original schematic source analysis.
hp compaq presario a900=1=compal_la-3981p_rev0.2.pdf
Technical Specifications
| Parameter | Value |
|---|---|
| Brand | Compal |
| Motherboard Manufacturer | Compal Electronics, Inc. |
| Project Code | LEON 1.0 |
| Board Number | LA-3981P |
| Revision | 0.3 |
| Date | 2007-08-02 |
| CPU Platform | Mobile Merom uFCPGA with Santa Rosa Platform |
| CPU Socket | uFCPGA-478 |
| PCH / Southbridge | SB ICH8 |
| GPU Type | Crestline |
| Graphics Architecture | LEON 1.0 (Merom + Crestline + ICH8) |
| EC / KBC | ENE KB926 |
| Audio Codec | CX20561-12 |
| BIOS / SPI Flash | SPI ROM |
| BIOS Flash Exact Model | 25LF080A |
| LAN IC | RTL8100CL |
| RAM Type | DDR2 |
| RAM Architecture | DDR2-SO-DIMM X2 |
| RAM Quantity / Slots | 2 |
| Thermal Sensor | ADM1032AR |
| Card Reader IC | USB Card Reader |
Technical Summary
This Compal LA-3981P revision 0.3 schematic, dated 2007-08-02, documents the LEON 1.0 platform featuring a Mobile Merom uFCPGA CPU in a Socket P with the Santa Rosa platform. The platform architecture is Merom + Crestline + ICH8, with the Crestline GPU integrated. The system uses an ENE KB926 EC/KBC and an SPI ROM BIOS flash, specifically the 25LF080A model. Memory configuration consists of two DDR2 SO-DIMM slots supporting DDR2-400/533/667. The audio subsystem is handled by a Conexant CX20561-12 codec, and networking is provided by a Realtek RTL8100CL LAN IC. Thermal management is managed by an ADM1032AR sensor. The board supports a USB card reader and includes a CX20548 modem.
Technician FAQ
Q: What BIOS IC model is used on this motherboard?
A: The BIOS SPI ROM is a 25LF080A.
Q: What EC/KBC controller is used on this motherboard?
A: The EC/KBC is an ENE KB926.
Q: What is the platform architecture of this motherboard?
A: The platform is LEON 1.0, consisting of a Mobile Merom CPU, Crestline graphics, and an ICH8 southbridge.
Q: What is the memory configuration on this motherboard?
A: The board supports two DDR2 SO-DIMM slots with DDR2-400/533/667 memory.
Technical data structured and organized by Dr-Bios.com, based on original schematic source analysis.
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