Schematic inventec envy 6050a2237701-wireless rev a01 mv 2009.04.10 schematic

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inventec envy 6050a2237701-wireless rev a01 mv 2009.04.10




Technical Specifications

ParameterValue
BrandENVY
Motherboard ManufacturerINVENTEC
Project CodeA22377-0-MTR1
Board NumberA22377-0-MTR1
Revision5A3CS
Date24-Apr-2009
Document NumberA22377-0-MTR1

Technical Summary

This ENVY wireless SDIO sub-board, manufactured by INVENTEC under project code A22377-0-MTR1 revision 5A3CS dated 24-Apr-2009, integrates multiple wireless modules. The primary WLAN module is a Murata LBWA18HLZZ in a QFN-48 package. Additional RF front-end components include Murata XM0860SH balun/filter devices in LGA-6P packages, a TI TPS73101DBVR LDO regulator in SOT23-5, and a TC7SZ04FU inverter. The board features dual antenna paths (Main and AUX) with I-PEX 20279-001E-01 coaxial connectors and supports SDIO interface connectivity.

Technician FAQ

Q: What is the board number and revision of this ENVY wireless SDIO sub-board?

A: The board number is A22377-0-MTR1, revision 5A3CS, manufactured by INVENTEC.

Q: What WLAN module is used on this board?

A: The primary WLAN module is a Murata LBWA18HLZZ in a QFN-48 package.

Q: What RF balun/filter components are present on this board?

A: Multiple Murata XM0860SH devices in LGA-6P packages are used for RF signal conditioning.

Technical data structured and organized by Dr-Bios.com, based on original schematic source analysis.
 

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