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Lenovo Yoga Slim 7 13ITL05 Huaqin NB2608 Schematic
Technical Specifications
Technical Summary
The HuaQin S750-13/NB2608 motherboard is built around an Intel TGL Lake UP3-Processor with LPDDR4x non-ECC memory architecture, supporting dual-channel memory down configurations with 2x X32 channels at 3200 MT/s. The platform utilizes an IT5571VG EC/KBC and a Realtek ALC3306-CG audio codec. BIOS storage is split across two SPI ROMs: a 16MB primary and an 8MB secondary. Charging and PD control is handled by TI TPS65994 controllers, with BB-TBT Retimers for Type-C and HDMI connectivity. The board includes a GL9755 card reader controller, BB-USB/DP Retimer for USB hub functionality, and WLAN/BT connectivity via an M.2 connector. Thermal monitoring is provided by TCP0, TCP1, TCP2, and TCP3 sensors. Memory options include Samsung K4U6E3S4AA-MGCR, Micron MT53E512M32D2NP-046 WT:E, and Hynix H9HCNNNBKMMLHR-NEE 16Gb ICs, with 32Gb variants for higher capacity configurations.
Technician FAQ
Q: What EC/KBC is used on this motherboard?
A: The motherboard uses an IT5571VG EC/KBC.
Q: What BIOS flash configuration does this board use?
A: The board uses two SPI ROMs: a 16MB SPI ROM 1 and an 8MB SPI ROM 2.
Q: What charging ICs are used on this motherboard?
A: The board uses TI PD TPS65994 controllers for USB-C PD and charging.
Q: What memory architecture does this board support?
A: The board supports LPDDR4x non-ECC memory down configuration with dual-channel 2x X32 at 3200 MT/s.
Technical data structured and organized by Dr-Bios.com, based on original schematic source analysis.
Technical Specifications
| Parameter | Value |
|---|---|
| Brand | HuaQin |
| Model | S750-13/NB2608 |
| Motherboard Manufacturer | Huaqin Telecom Technology Com.,Ltd. |
| Project Name | S750-13/NB2608 |
| Revision | V4.0 |
| Date | Friday, July 31, 2020 |
| CPU Platform | Intel TGL Lake UP3-Processor |
| EC / KBC | IT5571VG |
| Audio Codec | Realtek ALC3306-CG |
| BIOS / SPI Flash | SPI ROM 1 (16MB), SPI ROM 2 (8MB) |
| Charging IC | TI PD TPS65994 |
| RAM Type | LPDDR4x |
| RAM Architecture | Memory Down, Dual Channel, 2x X32 |
| RAM Quantity / Slots | Memory Down |
| Card Reader IC | GL9755 |
| USB Hub IC | BB-USB/DP Retimer |
| WiFi / WLAN IC | WLAN/BT M.2 CONN |
| HDMI Level Shifter | BB-TBT Retimer |
| Thermal Sensor | TCP0, TCP1, TCP2, TCP3 |
Technical Summary
The HuaQin S750-13/NB2608 motherboard is built around an Intel TGL Lake UP3-Processor with LPDDR4x non-ECC memory architecture, supporting dual-channel memory down configurations with 2x X32 channels at 3200 MT/s. The platform utilizes an IT5571VG EC/KBC and a Realtek ALC3306-CG audio codec. BIOS storage is split across two SPI ROMs: a 16MB primary and an 8MB secondary. Charging and PD control is handled by TI TPS65994 controllers, with BB-TBT Retimers for Type-C and HDMI connectivity. The board includes a GL9755 card reader controller, BB-USB/DP Retimer for USB hub functionality, and WLAN/BT connectivity via an M.2 connector. Thermal monitoring is provided by TCP0, TCP1, TCP2, and TCP3 sensors. Memory options include Samsung K4U6E3S4AA-MGCR, Micron MT53E512M32D2NP-046 WT:E, and Hynix H9HCNNNBKMMLHR-NEE 16Gb ICs, with 32Gb variants for higher capacity configurations.
Technician FAQ
Q: What EC/KBC is used on this motherboard?
A: The motherboard uses an IT5571VG EC/KBC.
Q: What BIOS flash configuration does this board use?
A: The board uses two SPI ROMs: a 16MB SPI ROM 1 and an 8MB SPI ROM 2.
Q: What charging ICs are used on this motherboard?
A: The board uses TI PD TPS65994 controllers for USB-C PD and charging.
Q: What memory architecture does this board support?
A: The board supports LPDDR4x non-ECC memory down configuration with dual-channel 2x X32 at 3200 MT/s.
Technical data structured and organized by Dr-Bios.com, based on original schematic source analysis.
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