Schematic otherbrand compal la-1671 bcl50 rev1.0 schematic

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otherbrand compal la-1671 bcl50_rev1.0 schematic

otherbrand=1=compal la-1671 bcl50_rev1.0.pdf




Technical Specifications

ParameterValue
BrandCompal
ModelBCL50
Motherboard ManufacturerCompal Electronics, Inc.
Board NumberLA-1671
Revision1.0
Date2003-03-14
CPU PlatformMobile Banias
CPU SocketuFCBGA/uFCPGA
PCH / SouthbridgeICH4-M
EC / KBCNS PC87591L
Audio CodecALC202
LAN ICRTL 8100L
Card Reader ICENE CB1410
Thermal SensorMAX6654
RAM TypeDDR
RAM ArchitectureDDR-SO-DIMM X2
RAM Quantity / Slots2
WiFi / WLAN ICWinbond W83L518D
SIOLPC47N227
1394 ControllerVIA VT6307S

Technical Summary

The Compal BCL50 (LA-1671 Rev 1.0) motherboard is built around the Mobile Banias CPU platform with a uFCBGA/uFCPGA socket and ICH4-M southbridge. The system uses DDR memory via two DDR-SO-DIMM slots. The embedded controller is an NS PC87591L, and the Super I/O is an LPC47N227. Audio is handled by an ALC202 AC97 codec. Networking includes an RTL 8100L LAN controller and a Winbond W83L518D for Bluetooth/WLAN interfacing. A VIA VT6307S provides 1394 FireWire connectivity, and an ENE CB1410 manages CardBus slots. Thermal monitoring is performed by a MAX6654 sensor. The board supports AGP 4X graphics and includes a legacy I/O option.

Technician FAQ

Q: What EC/KBC is used on this motherboard?

A: The EC/KBC is an NS PC87591L.

Q: What audio codec is used on this motherboard?

A: The audio codec is an ALC202.

Q: What LAN IC is used on this motherboard?

A: The LAN IC is an RTL 8100L.

Q: What memory type and configuration does this board support?

A: The board supports DDR memory via two DDR-SO-DIMM slots.

Technical data structured and organized by Dr-Bios.com, based on original schematic source analysis.
 

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