sony vaio vpc-eb foxconn m960 m970 h model_mbx-224_revsa schematic
sony vaio vpc-eb=1=foxconn m960 m970 h model_mbx-224_revsa.pdf
Technical Specifications
Technical Summary
This FOXCONN M960&M970 H Model motherboard is built on the Intel Calpella platform with an Arrandale processor in a Micro-FCPGA-989 socket paired with the Ibex Peak-M (HM55) PCH. Graphics are handled by discrete AMD Madison/Park solutions, with Madison DDR3 1GB or Park DDR3 512MB VRAM configurations. The system uses two DDR(III) SO-DIMM slots supporting 800/1066 MHz memory. Embedded control is managed by a Winbond NPCE783L EC/KBC, while audio is provided by a Realtek ALC269 codec. The board features dual SPI flash BIOS configurations: a 32M bit main flash and a 1M bit SPI flash. Power management includes a BQ24753 charger, MAX17030 CPU DC/DC converter, and TPS51218/TPS51217 system DC/DC converters. Networking is handled by Marvell 88E8059/88E8057 GbE controllers, and a Ricoh R5U231 card reader supports MS Duo and SD cards. The board number is 1P-0099J00-80SB (IRIS MB) with revision A31, dated December 24, 2009.
Technician FAQ
Q: What BIOS IC configurations are used on this motherboard?
A: This motherboard uses two SPI flash BIOS configurations: a 32M bit (4MB) main flash and a 1M bit SPI flash.
sony vaio vpc-eb=1=foxconn m960 m970 h model_mbx-224_revsa.pdf
Technical Specifications
| Parameter | Value |
|---|---|
| Brand | FOXCONN |
| Model | M960&M970 H Model |
| Motherboard Manufacturer | HON HAI Precision Ind. Co., Ltd. / FOXCONN |
| Project Code | M960&M970 H Model |
| Board Number | 1P-0099J00-80SB (IRIS MB) |
| Revision | A31 |
| Date | Thursday, December 24, 2009 |
| CPU Platform | Calpella Platform |
| CPU Model | Arrandale Processor |
| CPU Socket | Micro-FCPGA-989 (989-pin rPGA socket) |
| PCH / Southbridge | Ibex Peak-M (HM55) |
| GPU Type | AMD Madison/Park Discrete Graphic |
| Graphics Architecture | AMD Madison-LP M2 / Park-XT M2 GFX |
| dGPU Chip Number | Madison DDR3 1GB (1Gbx8pcs) / Park DDR3 512MB (1Gbx4pcs) |
| EC / KBC | Winbond NPCE783L |
| Audio Codec | Realtek ALC269 |
| BIOS / SPI Flash | Flash BIOS 32M bit X 1 / Flash BIOS 1M bit x1 SPI |
| Charging IC | BQ24753 |
| Charger Architecture | CHARGER BQ24753 |
| Power IC(s) | MAX17030, TPS51218, TPS51217, SN0608098, G2998 |
| RAM Type | DDR(III) |
| RAM Architecture | SO-DIMM 0 / SO-DIMM 1 |
| RAM Quantity / Slots | 2 |
| Thermal Sensor | W83L771AWG |
| Card Reader IC | Ricoh R5U231 |
| LAN IC | Marvell 88E8059 / 88E8057 |
| WiFi / WLAN IC | Mini-PCIE Card (WLAN) |
| HDMI Level Shifter | Kom LG-2413S-1S |
Technical Summary
This FOXCONN M960&M970 H Model motherboard is built on the Intel Calpella platform with an Arrandale processor in a Micro-FCPGA-989 socket paired with the Ibex Peak-M (HM55) PCH. Graphics are handled by discrete AMD Madison/Park solutions, with Madison DDR3 1GB or Park DDR3 512MB VRAM configurations. The system uses two DDR(III) SO-DIMM slots supporting 800/1066 MHz memory. Embedded control is managed by a Winbond NPCE783L EC/KBC, while audio is provided by a Realtek ALC269 codec. The board features dual SPI flash BIOS configurations: a 32M bit main flash and a 1M bit SPI flash. Power management includes a BQ24753 charger, MAX17030 CPU DC/DC converter, and TPS51218/TPS51217 system DC/DC converters. Networking is handled by Marvell 88E8059/88E8057 GbE controllers, and a Ricoh R5U231 card reader supports MS Duo and SD cards. The board number is 1P-0099J00-80SB (IRIS MB) with revision A31, dated December 24, 2009.
Technician FAQ
Q: What BIOS IC configurations are used on this motherboard?
A: This motherboard uses two SPI flash BIOS configurations: a 32M bit (4MB) main flash and a 1M bit SPI flash.
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