sony vaio vpc-eb foxconn m960 m970 l model_mbx-223_revsa schematic
sony vaio vpc-eb=1=foxconn m960 m970 l model_mbx-223_revsa.pdf
Technical Specifications
Technical Summary
This Foxconn M960 & M970 L Model motherboard, documented under board number 1P-0099J00-60SB (IRIS MB) with revision A3173 dated December 24, 2009, is built on the Intel Calpella Platform with UMA graphics. The platform utilizes an Intel Arrandale processor in a Micro-FCPGA-989 socket paired with the Ibex Peak-M (HM55) PCH. System memory consists of two DDR3 SO-DIMM slots supporting 800/1066 MHz modules. The embedded controller is a Winbond NPCE783L, and the audio subsystem is handled by a Realtek ALC269 codec. The BIOS is stored on a 32Mbit SPI flash ROM. Power management is handled by a BQ24753 charger IC, with system DC/DC conversion provided by TPS51218, MAX17030, MAX17028, and SN0608098 regulators. Networking is provided by a Marvell 88E8059 Gigabit Ethernet controller, and a Ricoh R5U231 card reader supports MS Duo and SD Card formats.
Technician FAQ
Q: What BIOS IC model is used on this motherboard?
A: The schematic references a 32M bit x1 SPI Flash BIOS ROM.
Q: What EC/KBC is used on this motherboard?
A: The embedded controller is a Winbond NPCE783L.
Q: What is the charging IC and architecture?
A: The charging IC is a BQ24753.
Q: What is the memory configuration?
A: The motherboard supports two DDR3 SO-DIMM slots at 800/1066 MHz.
Technical data structured and organized by Dr-Bios.com, based on original schematic source analysis.
sony vaio vpc-eb=1=foxconn m960 m970 l model_mbx-223_revsa.pdf
Technical Specifications
| Parameter | Value |
|---|---|
| Brand | Foxconn |
| Model | M960 & M970 L Model |
| Motherboard Manufacturer | HON HAI Precision Ind. Co., Ltd. / Foxconn |
| Project Code | M960 & M970 L Model |
| Board Number | 1P-0099J00-60SB (IRIS MB) |
| Revision | A3173 |
| Date | Thursday, December 24, 2009 |
| CPU Platform | Calpella Platform UMA Graphic |
| CPU Model | Arrandale Processor |
| CPU Socket | Micro-FCPGA-989 (989-pin rPGA socket) |
| PCH / Southbridge | Ibex Peak-M (HM55) |
| GPU Type | UMA Graphic |
| Graphics Architecture | UMA |
| EC / KBC | Winbond NPCE783L |
| Audio Codec | Realtek ALC269 |
| BIOS / SPI Flash | Flash BIOS 1M bit x1 SPI |
| BIOS Flash Capacity | 32M bit X 1 |
| Charging IC | BQ24753 |
| Charger Architecture | ADC_IN |
| Power IC(s) | MAX17030, TPS51218, SN0608098, MAX17028 |
| RAM Type | DDR(III) |
| RAM Architecture | SO-DIMM 0, SO-DIMM 1 |
| RAM Quantity / Slots | 2 |
| Thermal Sensor | G781-1 |
| Card Reader IC | Ricoh R5U231 |
| LAN IC | Marvell 88E8059 |
| WiFi / WLAN IC | Mini-PCIE Card (WLAN) |
Technical Summary
This Foxconn M960 & M970 L Model motherboard, documented under board number 1P-0099J00-60SB (IRIS MB) with revision A3173 dated December 24, 2009, is built on the Intel Calpella Platform with UMA graphics. The platform utilizes an Intel Arrandale processor in a Micro-FCPGA-989 socket paired with the Ibex Peak-M (HM55) PCH. System memory consists of two DDR3 SO-DIMM slots supporting 800/1066 MHz modules. The embedded controller is a Winbond NPCE783L, and the audio subsystem is handled by a Realtek ALC269 codec. The BIOS is stored on a 32Mbit SPI flash ROM. Power management is handled by a BQ24753 charger IC, with system DC/DC conversion provided by TPS51218, MAX17030, MAX17028, and SN0608098 regulators. Networking is provided by a Marvell 88E8059 Gigabit Ethernet controller, and a Ricoh R5U231 card reader supports MS Duo and SD Card formats.
Technician FAQ
Q: What BIOS IC model is used on this motherboard?
A: The schematic references a 32M bit x1 SPI Flash BIOS ROM.
Q: What EC/KBC is used on this motherboard?
A: The embedded controller is a Winbond NPCE783L.
Q: What is the charging IC and architecture?
A: The charging IC is a BQ24753.
Q: What is the memory configuration?
A: The motherboard supports two DDR3 SO-DIMM slots at 800/1066 MHz.
Technical data structured and organized by Dr-Bios.com, based on original schematic source analysis.
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