toshiba c660 c660d pwwae la-6843p lc-marseille 10ad_rev1.0 schematic
toshiba c660 c660d=1= pwwae la-6843p lc-marseille 10ad_rev1.0.pdf
Technical Specifications
Technical Summary
The Compal PWWAE LA-6843P Rev. 1.0 motherboard is built on the Mobile AMD S1G4 platform with an RS880M integrated GPU and an SB820M Southbridge. The system memory architecture consists of Dual Channel DDRIII, supported by two 200-pin DDRIII SO-DIMM slots. The embedded controller is an ENE KB926 E0, and the audio subsystem is handled by a Realtek ALC259 HDA Codec. Networking is provided by a Realtek RTL8105E 10/100M LAN controller. Thermal management is managed by an ADM1032ARMZ thermal sensor. The board was designed by Compal Electronics, Inc. and dated August 16, 2010.
Technician FAQ
Q: What is the board number and revision of this motherboard?
A: The board number is LA-6843P, revision Rev. 1.0.
Q: What EC/KBC is used on this motherboard?
A: The EC/KBC is an ENE KB926 E0.
Q: What is the CPU platform and chipset configuration?
A: The platform is Mobile AMD S1G4 with an RS880M GPU and an SB820M Southbridge.
Q: What type of memory does this motherboard support?
A: It supports Dual Channel DDRIII memory via two 200-pin DDRIII SO-DIMM slots.
Q: What LAN controller is used?
A: The LAN controller is a Realtek RTL8105E 10/100M.
Technical data structured and organized by Dr-Bios.com, based on original schematic source analysis.
toshiba c660 c660d=1= pwwae la-6843p lc-marseille 10ad_rev1.0.pdf
Technical Specifications
| Parameter | Value |
|---|---|
| Brand | Compal |
| Model | PWWAE LA-6843P |
| Motherboard Manufacturer | Compal Electronics, Inc. |
| Board Number | LA-6843P |
| Revision | Rev. 1.0 |
| Date | 2010-08-16 |
| CPU Platform | Mobile AMD S1G4 |
| PCH / Southbridge | SB820M |
| GPU Type | RS880M |
| EC / KBC | ENE KB926 E0 |
| Audio Codec | ALC259 |
| RAM Type | DDRIII |
| RAM Architecture | Dual Channel |
| RAM Quantity / Slots | 200pin DDRIII-SO-DIMM X2 |
| LAN IC | RTL8105E |
| Thermal Sensor | ADM1032ARMZ |
Technical Summary
The Compal PWWAE LA-6843P Rev. 1.0 motherboard is built on the Mobile AMD S1G4 platform with an RS880M integrated GPU and an SB820M Southbridge. The system memory architecture consists of Dual Channel DDRIII, supported by two 200-pin DDRIII SO-DIMM slots. The embedded controller is an ENE KB926 E0, and the audio subsystem is handled by a Realtek ALC259 HDA Codec. Networking is provided by a Realtek RTL8105E 10/100M LAN controller. Thermal management is managed by an ADM1032ARMZ thermal sensor. The board was designed by Compal Electronics, Inc. and dated August 16, 2010.
Technician FAQ
Q: What is the board number and revision of this motherboard?
A: The board number is LA-6843P, revision Rev. 1.0.
Q: What EC/KBC is used on this motherboard?
A: The EC/KBC is an ENE KB926 E0.
Q: What is the CPU platform and chipset configuration?
A: The platform is Mobile AMD S1G4 with an RS880M GPU and an SB820M Southbridge.
Q: What type of memory does this motherboard support?
A: It supports Dual Channel DDRIII memory via two 200-pin DDRIII SO-DIMM slots.
Q: What LAN controller is used?
A: The LAN controller is a Realtek RTL8105E 10/100M.
Technical data structured and organized by Dr-Bios.com, based on original schematic source analysis.
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