Salim Badakhshan
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Xiaomi Mi Notebook 12.5 Indian version Schematic
Technical Specifications
Technical Summary
This is a Huaqin Telecom Technology Co., Ltd. motherboard for the XM AIR 12.5 INDIA project, revision V1.0, dated Friday, April 14, 2017. The platform utilizes LPDDR3 memory architecture on channel LPDDR3_CH0, with detailed routing for data, address, command, clock, and strobe signals. The memory subsystem includes support for multiple chip selects, clock enables, and ODT signals, indicating a dual-rank or multi-rank configuration. The schematic provides extensive signal-level documentation for the LPDDR3 interface, including DQ, DQS, and CA lines, as well as reference voltage nets VREFDQ0_SOC and VREFCA0_SOC. The board is designed for a mobile or ultrabook form factor, with a focus on memory-intensive computing tasks.
Technician FAQ
Q: What is the project name and revision of this motherboard?
A: The project name is XM AIR 12.5 INDIA, revision V1.0.
Q: What type of memory is used on this motherboard?
A: The motherboard uses LPDDR3 memory on channel LPDDR3_CH0.
Q: Who manufactured this motherboard?
A: The motherboard was manufactured by Huaqin Telecom Technology Co., Ltd.
Technical data structured and organized by Dr-Bios.com, based on original schematic source analysis.
Technical Specifications
| Parameter | Value |
|---|---|
| Brand | Huaqin Telecom Technology Co., Ltd. |
| Revision | V1.0 |
| Date | Friday, April 14, 2017 |
| RAM Type | LPDDR3 |
| RAM Architecture | LPDDR3_CH0 |
Technical Summary
This is a Huaqin Telecom Technology Co., Ltd. motherboard for the XM AIR 12.5 INDIA project, revision V1.0, dated Friday, April 14, 2017. The platform utilizes LPDDR3 memory architecture on channel LPDDR3_CH0, with detailed routing for data, address, command, clock, and strobe signals. The memory subsystem includes support for multiple chip selects, clock enables, and ODT signals, indicating a dual-rank or multi-rank configuration. The schematic provides extensive signal-level documentation for the LPDDR3 interface, including DQ, DQS, and CA lines, as well as reference voltage nets VREFDQ0_SOC and VREFCA0_SOC. The board is designed for a mobile or ultrabook form factor, with a focus on memory-intensive computing tasks.
Technician FAQ
Q: What is the project name and revision of this motherboard?
A: The project name is XM AIR 12.5 INDIA, revision V1.0.
Q: What type of memory is used on this motherboard?
A: The motherboard uses LPDDR3 memory on channel LPDDR3_CH0.
Q: Who manufactured this motherboard?
A: The motherboard was manufactured by Huaqin Telecom Technology Co., Ltd.
Technical data structured and organized by Dr-Bios.com, based on original schematic source analysis.
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