Salim Badakhshan
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Lenovo ThinkCentre M710e IB250CX-SVT Schematic
Technical Specifications
Technical Summary
The Lenovo M710e BIDDING BOX motherboard, manufactured by Foxconn, is based on the Kabylake-S platform with an LGA 1151 socket and Kabylake-S PCH-H B250 chipset. The board uses a 4-layer PCB measuring 11.179 x 7.874 inches with green soldermask and white silkscreen, revision V1.0. System memory consists of two DDR4 2400 channels (CHA and CHB). The embedded controller and Super I/O are handled by an IT8629E, while audio is provided by an ALC233 codec. Networking is via an RTL8111HN-CG LAN IC. The BIOS is stored on a 64Mb SPI ROM. A TPM SLB9670VQ2.0 is present, and the board includes an IT6516BFN/CX for DP to VGA conversion. The schematic is dated 2017/11/28 at SVT phase, with BOM version 0.2.
Technician FAQ
Q: What is the board number and revision of this Lenovo M710e motherboard?
A: The board number is PCB_B250_ETC, revision V1.0.
Q: What EC/KBC and SIO are used on this motherboard?
A: The EC/KBC and SIO are both the IT8629E.
Q: What is the BIOS flash configuration on this motherboard?
A: The BIOS is stored on a 64Mb SPI ROM.
Q: What LAN IC is used on this motherboard?
A: The LAN IC is an RTL8111HN-CG.
Q: What TPM module is used on this motherboard?
A: The TPM module is an SLB9670VQ2.0.
Technical data structured and organized by Dr-Bios.com, based on original schematic source analysis.
Technical Specifications
| Parameter | Value |
|---|---|
| Brand | Lenovo |
| Model | M710e |
| Motherboard Manufacturer | Foxconn |
| Project Code | BIDDING BOX |
| Board Number | PCB_B250_ETC |
| Revision | V1.0 |
| Date | 2017/11/28 |
| CPU Platform | Kabylake-S |
| CPU Socket | LGA 1151 |
| PCH / Southbridge | Kabylake-S PCH-H B250 |
| EC / KBC | IT8629E |
| Audio Codec | ALC233 |
| BIOS / SPI Flash | 64Mb SPI ROM |
| LAN IC | RTL8111HN-CG |
| RAM Type | DDR4 2400 |
| RAM Architecture | CHA / CHB |
| RAM Quantity / Slots | 2 |
| Card Reader IC | IT6516BFN/CX |
| TPM | SLB9670VQ2.0 |
| SIO | IT8629E |
| PCB Layer Count | 4-Layer PCB |
| PCB Dimensions | 11.179X7.874inch |
| PCB Color | Green |
| Silkscreen Color | White |
| Phase | SVT |
| BOM Version | 0.2 |
| SVID | 17AA |
| SSID | 313C |
| Document Number | C163 |
Technical Summary
The Lenovo M710e BIDDING BOX motherboard, manufactured by Foxconn, is based on the Kabylake-S platform with an LGA 1151 socket and Kabylake-S PCH-H B250 chipset. The board uses a 4-layer PCB measuring 11.179 x 7.874 inches with green soldermask and white silkscreen, revision V1.0. System memory consists of two DDR4 2400 channels (CHA and CHB). The embedded controller and Super I/O are handled by an IT8629E, while audio is provided by an ALC233 codec. Networking is via an RTL8111HN-CG LAN IC. The BIOS is stored on a 64Mb SPI ROM. A TPM SLB9670VQ2.0 is present, and the board includes an IT6516BFN/CX for DP to VGA conversion. The schematic is dated 2017/11/28 at SVT phase, with BOM version 0.2.
Technician FAQ
Q: What is the board number and revision of this Lenovo M710e motherboard?
A: The board number is PCB_B250_ETC, revision V1.0.
Q: What EC/KBC and SIO are used on this motherboard?
A: The EC/KBC and SIO are both the IT8629E.
Q: What is the BIOS flash configuration on this motherboard?
A: The BIOS is stored on a 64Mb SPI ROM.
Q: What LAN IC is used on this motherboard?
A: The LAN IC is an RTL8111HN-CG.
Q: What TPM module is used on this motherboard?
A: The TPM module is an SLB9670VQ2.0.
Technical data structured and organized by Dr-Bios.com, based on original schematic source analysis.
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