Salim Badakhshan
Registered
Lenovo Yoga Duet 7 13ITL6 Huaqin NB2936 NB2936_MB_V3 Schematic
Technical Specifications
Technical Summary
The HuaQin NB2936_TGL REV3.0 motherboard is built on the Intel TGL Lake UP3 platform with a 28W BGA-1449 CPU supporting DDR4x memory. The memory subsystem is configured as single-channel 1.2V DDR4x at 3200 MT/s with 4 x16 memory-down architecture. The board utilizes two SPI flash devices: a 16MBIT SPI ROM 1 and an 8MB SPI ROM 2 for BIOS and firmware storage. Audio is handled by the Realtek ALC3306-CG codec. The board integrates an on-board WLAN 1216 module for networking. USB-C connectivity is managed by the TI PD TPS65994 controller. A discrete SAR sensor is present for card reader functionality, and a TCP0 thermal sensor is included for temperature monitoring.
Technician FAQ
Q: What BIOS IC models are used on this motherboard?
A: The board uses two SPI flash devices: a 16MBIT SPI ROM 1 and an 8MB SPI ROM 2.
Q: What is the memory configuration on this motherboard?
A: The memory is single-channel 1.2V DDR4x at 3200 MT/s with a memory-down architecture using 4 x16 devices.
Q: What audio codec is used on this motherboard?
A: The audio codec is the Realtek ALC3306-CG.
Q: What USB-C controller is used on this motherboard?
A: The USB-C controller is the TI PD TPS65994.
Technical data structured and organized by Dr-Bios.com, based on original schematic source analysis.
Technical Specifications
| Parameter | Value |
|---|---|
| Brand | HuaQin |
| Project Code | NB2936_TGL |
| Board Number | NB2936_MB&TOF Schematics Document |
| Revision | REV3.0 |
| Date | Monday, December 07, 2020 |
| CPU Platform | Intel TGL Lake UP3-Processor with DDR4x MD |
| CPU Model | Intel CPU TGL-UP3 28W BGA-1449 45.5x25x1.27 13" |
| Audio Codec | Realtek ALC3306-CG |
| BIOS / SPI Flash | SPI ROM 1 (16MBIT), SPI ROM 2 (8MB) |
| RAM Type | DDR4x |
| RAM Architecture | Single Channel 1.2V DDR4x 3200 MT/s MEMORY DOWN 4 * X16 |
| LAN IC | WLAN 1216 (on board) |
| WiFi / WLAN IC | WLAN 1216 (on board) |
| Card Reader IC | Discrete SAR |
| USB Hub IC | TI PD TPS65994 |
| Thermal Sensor | Thermal Sensor TCP0 |
Technical Summary
The HuaQin NB2936_TGL REV3.0 motherboard is built on the Intel TGL Lake UP3 platform with a 28W BGA-1449 CPU supporting DDR4x memory. The memory subsystem is configured as single-channel 1.2V DDR4x at 3200 MT/s with 4 x16 memory-down architecture. The board utilizes two SPI flash devices: a 16MBIT SPI ROM 1 and an 8MB SPI ROM 2 for BIOS and firmware storage. Audio is handled by the Realtek ALC3306-CG codec. The board integrates an on-board WLAN 1216 module for networking. USB-C connectivity is managed by the TI PD TPS65994 controller. A discrete SAR sensor is present for card reader functionality, and a TCP0 thermal sensor is included for temperature monitoring.
Technician FAQ
Q: What BIOS IC models are used on this motherboard?
A: The board uses two SPI flash devices: a 16MBIT SPI ROM 1 and an 8MB SPI ROM 2.
Q: What is the memory configuration on this motherboard?
A: The memory is single-channel 1.2V DDR4x at 3200 MT/s with a memory-down architecture using 4 x16 devices.
Q: What audio codec is used on this motherboard?
A: The audio codec is the Realtek ALC3306-CG.
Q: What USB-C controller is used on this motherboard?
A: The USB-C controller is the TI PD TPS65994.
Technical data structured and organized by Dr-Bios.com, based on original schematic source analysis.
Attachments
Last edited by a moderator:
