sony vaio vpc-cw foxconn m870-1-01 mbx-214_rev1.0 schematic
sony vaio vpc-cw=1=foxconn m870-1-01 mbx-214_rev1.0.pdf
Technical Specifications
Technical Summary
This Foxconn M870 Main Board_8L schematic, revision 1.0 dated July 27, 2009, documents a Montevina platform motherboard supporting Penryn/Merom/PDC processors via a Micro-FCPGA-478 socket. The platform is built around the Intel Cantiga PM45/GM45 Northbridge and ICH9-M Southbridge, with discrete graphics provided by an Nvidia N10M-GS or N10P-LP GPU using GDDR3 VRAM. System memory consists of two DDRIII SO-DIMM slots supporting 800/1066 MHz. The embedded controller is a Winbond WPCE775L in an LQFP-128 package, and the audio subsystem is handled by a Realtek ALC262VD2 codec. The BIOS is a 16M bit SPI flash ROM. Power management includes a TI BQ24753 charger IC, an ISL6266A CPU core DC/DC converter, and multiple system DC/DC converters from SC411, SC412, and MAX17020. Networking is provided by a Marvell 88E8057 LAN IC and a KOMLG-2413S-1 wireless module. Thermal monitoring uses W83L771AWG and G709T1UF sensors, and the card reader is a Ricoh R5U231.
Technician FAQ
Q: What EC/KBC is used on this motherboard?
A: The embedded controller is a Winbond WPCE775L in an LQFP-128 package.
Q: What is the BIOS flash configuration?
A: The BIOS is a 16M bit SPI flash ROM.
sony vaio vpc-cw=1=foxconn m870-1-01 mbx-214_rev1.0.pdf
Technical Specifications
| Parameter | Value |
|---|---|
| Brand | Foxconn |
| Motherboard Manufacturer | HON HAI Precision Ind. Co., Ltd. CCPBG - R&D Division / FOXCONN |
| Project Code | M870 |
| Board Number | M870 Main Board_8L |
| Revision | 1.0 |
| Date | Monday, July 27, 2009 |
| Document Number | M870-1-01 |
| CPU Platform | Penryn / Merom/PDC |
| CPU Socket | Micro-FCPGA-478 (478-pin socket P) |
| PCH / Southbridge | ICH9-M |
| Northbridge | Cantiga PM45/GM45 |
| GPU Type | Nvidia N10M-GS / N10P-LP |
| Graphics Architecture | GDDR3 |
| EC / KBC | Winbond WPCE775L |
| EC/KBC Package | LQFP-128 |
| Audio Codec | Realtek ALC262VD2 |
| BIOS / SPI Flash | Flash BIOS 16M bit SPI |
| Charging IC | TI BQ24753 |
| Charger Architecture | TI CHARGER |
| Power IC(s) | ISL6266A, SC411+APL5913, SC412+G2998, MAX17020ETJ+ |
| RAM Type | DDR(III) |
| RAM Architecture | SO-DIMM 0 800/1066 MHz, SO-DIMM 1 800/1066 MHz |
| RAM Quantity / Slots | 2 |
| Thermal Sensor | W83L771AWG, W83L771AWG-2, G709T1UF |
| Card Reader IC | RICOH R5U231 |
| LAN IC | Marvell 88E8057 |
| WiFi / WLAN IC | KOMLG-2413S-1 |
| HDMI Level Shifter | Pro-HG MS DUO |
Technical Summary
This Foxconn M870 Main Board_8L schematic, revision 1.0 dated July 27, 2009, documents a Montevina platform motherboard supporting Penryn/Merom/PDC processors via a Micro-FCPGA-478 socket. The platform is built around the Intel Cantiga PM45/GM45 Northbridge and ICH9-M Southbridge, with discrete graphics provided by an Nvidia N10M-GS or N10P-LP GPU using GDDR3 VRAM. System memory consists of two DDRIII SO-DIMM slots supporting 800/1066 MHz. The embedded controller is a Winbond WPCE775L in an LQFP-128 package, and the audio subsystem is handled by a Realtek ALC262VD2 codec. The BIOS is a 16M bit SPI flash ROM. Power management includes a TI BQ24753 charger IC, an ISL6266A CPU core DC/DC converter, and multiple system DC/DC converters from SC411, SC412, and MAX17020. Networking is provided by a Marvell 88E8057 LAN IC and a KOMLG-2413S-1 wireless module. Thermal monitoring uses W83L771AWG and G709T1UF sensors, and the card reader is a Ricoh R5U231.
Technician FAQ
Q: What EC/KBC is used on this motherboard?
A: The embedded controller is a Winbond WPCE775L in an LQFP-128 package.
Q: What is the BIOS flash configuration?
A: The BIOS is a 16M bit SPI flash ROM.
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