sony vaio vpc-f series foxconn m931_irx-5300_mbx-215_revsa schematic
sony vaio vpc-f series=1=foxconn m931_irx-5300_mbx-215_revsa.pdf
Technical Specifications
Technical Summary
This Foxconn M931 (MBX-215) SA schematic, dated January 6, 2010, details a Calpella platform motherboard supporting Arrandale and Clarksfield processors via a Micro-FCPGA-988A socket. The platform utilizes an Ibex Peak-M (PM55-B3) PCH and features discrete nVIDIA N11P/M graphics with N11P-GE1-A3 or N11M-GE1-A3 GPU chips. System BIOS is provided by a single 32Mbit SPI flash, while the EC firmware resides on a separate 1Mbit SPI ROM for the Winbond NPCE783L EC/KBC. Memory configuration includes two DDR3 SO-DIMM slots supporting up to 1333 MHz. The charging circuit is managed by a BQ24753 IC, with power delivery handled by MAX17030, TPS51218, SN0608098, SC412A, and MAX17028 DC/DC converters. Audio is driven by a Realtek ALC275-A5 codec, and wired networking is provided by a Marvell 88E8057 GbE controller. A Ricoh R5U231 card reader and an SLG8SP585 HDMI level shifter are also integrated into the design.
Technician FAQ
Q: What EC/KBC is used on this motherboard?
A: The motherboard uses a Winbond NPCE783L EC/KBC, with its firmware stored on a dedicated 1Mbit SPI ROM.
Q: What is the system BIOS configuration?
A: The system BIOS is a single 32Mbit SPI flash IC.
Q: What is the charging IC and power architecture?
A: The charging IC is a BQ24753. The system uses multiple DC/DC converters including MAX17030, TPS51218, SN0608098, SC412A, and MAX17028.
sony vaio vpc-f series=1=foxconn m931_irx-5300_mbx-215_revsa.pdf
Technical Specifications
| Parameter | Value |
|---|---|
| Brand | Foxconn |
| Model | M931 (MBX-215) |
| Motherboard Manufacturer | HON HAI Precision Ind. Co., Ltd. / Foxconn |
| Project Code | M931 (MBX-215) |
| Board Number | M931 |
| Revision | SA |
| Date | Wednesday, January 06, 2010 |
| CPU Platform | Calpella Platform |
| CPU Model | Arrandale & Clarksfield (SEAM) Processor |
| CPU Socket | Micro-FCPGA-988A (988-pin rPGA socket) |
| PCH / Southbridge | Ibex Peak-M (PM55-B3) |
| GPU Type | Discrete Graphic |
| Graphics Architecture | nVIDIA N11P/M |
| dGPU Chip Number | N11P-GE1-A3 / N11M-GE1-A3 |
| EC / KBC | Winbond NPCE783L |
| Audio Codec | Realtek ALC275-A5 |
| BIOS / SPI Flash | System BIOS 32M bit X 1 |
| EC Flash / ROM | EC Firmware 1M bit x1 SPI |
| Charging IC | BQ24753 |
| Power IC(s) | MAX17030, TPS51218, SN0608098, SC412A, MAX17028 |
| RAM Type | DDR(III) |
| RAM Architecture | SO-DIMM |
| RAM Quantity / Slots | 2 |
| Card Reader IC | Ricoh R5U231 |
| LAN IC | Marvell 88E8057 |
| WiFi / WLAN IC | Mini-PCIE Card (WLAN) |
| HDMI Level Shifter | SLG8SP585 |
Technical Summary
This Foxconn M931 (MBX-215) SA schematic, dated January 6, 2010, details a Calpella platform motherboard supporting Arrandale and Clarksfield processors via a Micro-FCPGA-988A socket. The platform utilizes an Ibex Peak-M (PM55-B3) PCH and features discrete nVIDIA N11P/M graphics with N11P-GE1-A3 or N11M-GE1-A3 GPU chips. System BIOS is provided by a single 32Mbit SPI flash, while the EC firmware resides on a separate 1Mbit SPI ROM for the Winbond NPCE783L EC/KBC. Memory configuration includes two DDR3 SO-DIMM slots supporting up to 1333 MHz. The charging circuit is managed by a BQ24753 IC, with power delivery handled by MAX17030, TPS51218, SN0608098, SC412A, and MAX17028 DC/DC converters. Audio is driven by a Realtek ALC275-A5 codec, and wired networking is provided by a Marvell 88E8057 GbE controller. A Ricoh R5U231 card reader and an SLG8SP585 HDMI level shifter are also integrated into the design.
Technician FAQ
Q: What EC/KBC is used on this motherboard?
A: The motherboard uses a Winbond NPCE783L EC/KBC, with its firmware stored on a dedicated 1Mbit SPI ROM.
Q: What is the system BIOS configuration?
A: The system BIOS is a single 32Mbit SPI flash IC.
Q: What is the charging IC and power architecture?
A: The charging IC is a BQ24753. The system uses multiple DC/DC converters including MAX17030, TPS51218, SN0608098, SC412A, and MAX17028.
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